International collaboration EU and Japan on semiconductors

Type of action: DIGITAL JU Simple Grants ">Conditions 1. Admissibility conditions: Proposal page limit and layout described in Appendix 8 of Work Programme - Chips for Europe Initiative call document. Proposal page limits and layout: described in Part B of the Application Form available in the Submission System. 2. Eligible countries described in Appendix 8 of Work Programme - Chips for Europe Initiative. 3. Other eligibility conditions Appendix 8 of Work Programme - Chips for Europe Initiative. 4. Financial and operational capacity and exclusion described Appendix 8 of Work Programme - Chips for Europe Initiative. 5a. Evaluation and award: Submission and evaluation processes described Appendix 8 of Work Programme - Chips for Europe Initiative and the Online Manual. 5b. Evaluation and award: Award criteria, scoring and thresholds described Appendix 8 of Work Programme - Chips for Europe Initiative. 5c. Evaluation and award: Indicative timeline for evaluation and grant agreement described in Appendix 8 of Work Programme - Chips for Europe Initiative. 6. Legal and financial set-up of the grants described Appendix 8 of Work Programme - Chips for Europe Initiative. Call Details Call document and annexes: Model Grant Agreements (MGA) DEP MGA Additional documents: DEP Regulation 2021/964 EU Financial Regulation 2024/2509 EU Grants AGA — Annotated Model Grant Agreement Funding & Tenders Portal Online Manual Funding & Tenders Portal Terms and Conditions Funding & Tenders Portal Privacy Statement